Mitsubishi ML562H84 Datasheet

Microsoft PowerPoint – GNOK-ML562H84-02_draftA.pptx
image/svg+xmlMITSUBISHIELECTRICCORPORATIONCONFIDENTIALCOMPANYPROPRIETARYNOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTENPERMISSIONOFMITSUBISHIELECTRICCORPORATIONSPECIFICATIONGNOK–ML562H84–02–draftA(1/6)SPECIFICATIONPREPAREDBY:M.MiyashitaREVAM.MiyashitaCHECKEDBY:APPROVEDBY:T.NishidaT.NishidaDATE:June.5,2017July.26,20171.TypeML562H84–022.ApplicationLightSource3.StructureRedLaserDiode4.OutlineG8803905.AbsolutemaximumratingsNo.PARAMETERSYMBOLCONDITIONRATINGSUNIT(1)OperationCurrentIopPulse(DutyCycle≦40%)Fig.1(2)ReverseVoltageVRL–2V(3)Anode–CaseVoltage(*1)Vac––200～200V(4)OperatingCaseTemperatureTc–0～+55℃(5)StorageTemperatureTstg––40～+85℃(6)SolderingTemperatureTsolLeadLength2mm320℃,2sec<Note>Themaximumratingmeansthelimitationoverwhichthelasershouldnotbeoperatedeveninstanttime,andthisdoesnotmeantheguaranteeofitslifetime.Asforthelifetime,refertothereliabilityreportfromMitsubishiSemiconductorQualityAssuranceSection.*1:VoltagebetweenΦ9packageandanodeleadpin6.CharacteristicstableNo.PARAMETERSYMBOLCONDITION（Tc=25℃(*2)unlessotherwisespecified)LIMITSUINTMIN.TYP.MAX.(1)OutputPowerPopPulse(*3),Iop=2.8A2.32.5–WPulse(*3),Iop=3.6A,Tc=45℃2.32.5–WPulse(*3),Iop=3.6A,Tc=55℃1.61.9–W(2)ThresholdCurrentIthPulse(*3)0.600.780.85A(3)OperatingVoltageVopPulse(*3),Iop=2.8A–2.42.5V(4)SlopeEfficiencyηPulse(*3)1.001.151.350W/A(5)PeakWavelengthλpPulse(*3),Iop=2.8A636638642nm(6)BeamDivergence(FullWidthat1/e2)θ//Pulse(*3),Iop=2.8A–3.64.0°θ⊥Pulse(*3),Iop=2.8A–0.51.4°(7)BeamTiltAngle(*4)Δθ//Pulse(*3),Iop=2.8A–1.501.5°Δθ⊥Pulse(*3),Iop=2.8A–1.501.5°*2:ActualmeasurementtemperatureisadjustedinordertomatchanactivelayertemperaturetothatofstableconditionatTc=25℃.*3:Pulsecondition120Hz,Duty=30%ThesespecificationsarebasedonMITSUBISHI’smethod.DraftAJuly.26,2017(Thisdraftspecificationisvalidfor6months)
image/svg+xmlMITSUBISHIELECTRICCORPORATIONCONFIDENTIALCOMPANYPROPRIETARYNOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTENPERMISSIONOFMITSUBISHIELECTRICCORPORATIONSPECIFICATIONGNOK–ML562H84–02–draftA(2/6)SPECIFICATION7.LDpackingspecification7–1.ThisspecificationisappliedtoML562H84–02packing.7–2.Materials7–3.Packingmethod(1)LDisinsertedinanelectricallyconductivetray[1],inordertopreventtheelectricallystaticdamage.Basically,eachLD–trayincludes80pcsLDs.Howeverthereisthetrayfilledbelow80pcs.(2)TheLDtrayispiledup.(Maximum5trays)(3)(2)issealedbyawrappingbag[2].(4)SealedLDtrays(3)arepiledupandputwithaircap[3]inaPackingbox[4].ThedetailsofeacharticleareshowninFig.2–Fig.4.ItemMaterialUse（Purpose）[1]TrayPolystyrenePreventelectricstaticdamage[2]WrappingbagPolyethyleneSealingtraybody[3]AircapPolyethylenePreventvibration[4]PackingboxCorrugatedcardboardPackageFig.1Absolutemaximumratingsofoperatingcurrentθ⊥（+）θ⊥（–）θ//（+）θ//（–）Topview*4:DefinitionofBeamAngle2.02.22.42.62.83.03.23.43.63.84.00102030405060AbsoluteMaxumumCurrent[A]CaseTemperature[℃]
image/svg+xmlMITSUBISHIELECTRICCORPORATIONCONFIDENTIALCOMPANYPROPRIETARYNOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTENPERMISSIONOFMITSUBISHIELECTRICCORPORATIONSPECIFICATIONGNOK–ML562H84–02–draftA(3/6)SPECIFICATION（Topside）（Backside）Fig.2LDtray
image/svg+xmlMITSUBISHIELECTRICCORPORATIONCONFIDENTIALCOMPANYPROPRIETARYNOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTENPERMISSIONOFMITSUBISHIELECTRICCORPORATIONSPECIFICATIONGNOK–ML562H84–02–draftA(4/6)SPECIFICATIONFig.4PackingHandlingwarningareshownonthebox.HandlingWarning[1]LDTray(electricallyconductivepolystyrene)[2]WrappingbagFig.3Insidepacking(TrayandWrappingbag)(Anemptytrayisputonthetopstageasalid.)
image/svg+xmlMITSUBISHIELECTRICCORPORATIONCONFIDENTIALCOMPANYPROPRIETARYNOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTENPERMISSIONOFMITSUBISHIELECTRICCORPORATIONSPECIFICATIONGNOK–ML562H84–02–draftA(5/6)SPECIFICATION8.SafetyprecautionsrelatingtohandlingofopticalsemiconductordevicesGeneral:Althoughmanufacturerisalwaysstrivingtoimprovethereliabilityofitsproducts,problemsanderrorsmayoccurwithsemiconductordevices.Hence,itisnecessarythatuser’sownproductsaredesignedwithfullregardtosafetybyincorporatingredundancy,fireprevention,anderrorprevention,soanyproblemsorerrorswithsemiconductordevicedonotcauseaccidents,whichmightresultininjury,death,fire,orenvironmentalhazard.Thefollowingrequirementsmustbestrictlyobserved.Warning!1.SafetystandardoflaserdevicesPleasefollowcloselytointernationalstandard(e.g.IEC60825–1)orstandardofeachcountry(ex.JISC6802inJapan).2.LasercharacteristicsanditsdangerWhenlaserdeviceisoperatedatover–drivencondition,lowtemperature,pulsingmode,andsoon,itcouldemithigheropticalpowerthanabsolutemaximumrating,andpeakopticalpowermightincreaseinconjunctionwithrelaxationoscillation.Laserdevicecouldlaseatdifferentwavelengthwithdifferentcasetemperature,ordifferentoutputpower.Laserdevicesaredeviatedonthresholdcurrent,operatingcurrent,operatingvoltage,slopeefficiency,peakwavelength,beamdivergence,andsoon.Notonlylightoutputpower,butalsopolarizationorfarfieldpatternsmightchangeasoperatingtimegoesby.Ifcustomersneedmoreinformationoflaserdevice,pleasecontactMitsubishiElectric.Laserlightfromeachdevicemightseriouslyinjurehumaneyesandskin.CustomershoulddesignandmanufacturecarefullytheirapplicationproductsbasedonnotonlylaserlightcharacteristicsbutalsoLDcharacteristics,inordertoavoidhumaninjury.MitsubishiElectricisnotresponsibleforanyaccidentsthatarecausedbycustomer’sproducts.Ifcustomersplantoreleasemedicaloraestheticproductswithlaserdevice,theyshouldobtaintheirgovernment’slasersafetyauthorization.3.AvoidlaserlightfromenteringhumaneyesInnormaloperation,semiconductorlaserdeviceemitslaserlight.Laserlightenteringeyescouldcauseextremedamage.Neverlookagainstlaserbeamdirection,andneverlookdirectlythroughanopticalsystemsuchasalens.UseanITVcameratoobservelaserlight.MitsubishiElectricrecommendsthatcustomersshouldexplicitlylabeltheirlaserproductswithwarningsignofeyeinjury.4.HandlingofdeviceGalliumarsenide(GaAs)andberylliumoxide(BeO)areusedinlaserdevice.Toavoiddanger,strictlyobservethefollowingcautions:Neverplacethedeviceinhumanmouth.Neverburnorbreakthedevice.Neveruseanytypeofchemicaltreatmenttoreduceittogasorpowder.Whendisposingdevice,alwaysfollowanyapplicablelaws,aswellascustomer’sinternalwastetreatmentregulations.5.DisposalofdeviceLaserdeviceusesGalliumarsenide(GaAs)andberylliumoxide(BeO).Itshouldbedisposedasaspeciallycontrolledindustrialwaste,anditshouldbeseparatedfromgeneralindustrialandhouseholdwastes,accordingtoany“LawofWastesandCleaning”.Caution!1.HightemperatureDuringoperationdevicemaybecomehot,thereforedonotdirectlytouchitduringoperation.Thedevicecouldremainhotevenafterpoweristurnedoff,sowaituntilitcoolsdownpriortotouchingtoavoidanyburn.Neverplaceanyinflammablesubstancethatmaycausefirenearthedevice.
image/svg+xmlMITSUBISHIELECTRICCORPORATIONCONFIDENTIALCOMPANYPROPRIETARYNOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTENPERMISSIONOFMITSUBISHIELECTRICCORPORATIONSPECIFICATIONGNOK–ML562H84–02–draftA(6/6)SPECIFICATION9.HandlingCautionsforOptoelectronicDevices1.General(1–1)Theproductsdescribedinthisspecificationaredesignedandmanufacturedforuseingeneralcommunicationsystemsorelectronicdevices,unlesstheirapplicationsorreliabilityareotherwisespecified.Therefore,theyarenotdesignedormanufacturedforinstallationindevicesorsystemsthatmayaffecthumanlifeorthatareusedinsocialinfrastructurerequiringhighreliability.(1–2)Whenthecustomerisconsideringtousetheproductsdescribedinthisspecificationinspecialapplications,suchastransportationsystems(automobiles,trains,vessels),medicalequipments,aerospace,nuclearpowercontrol,andsubmarinerepeatersorsystems,pleasecontactMitsubishiElectricoranauthorizeddistributor.2.StorageConditionsWhenstoringtheproducts,itisrecommendedtostorethemfollowingtheconditionsdescribedbelowwithoutopeningthepacking.Nottakingenoughcareinstoringmayresultindefectsinelectricalcharacteristics,solderingquality,visualappearance,andsoon.Themainpointsaredescribedbelow(ifspecialstorageconditionsaregiventotheproductinthespecificationsheet,theyhavepriorityoverthefollowinggeneralcautions):(2–1)Appropriatetemperatureandhumidityconditions,i.e.,temperaturerangebetween5～35℃,andhumiditybetween45～75percentRH,shouldbemaintainedinstoragelocations.Controllingthetemperatureandhumiditywithinthisrangeisparticularlyimportantincaseoflong–termstorageforsixmonthsormore.(2–2)Theatmosphereshouldbeparticularlyfreefromtoxicgasesanddust.(2–3)Donotapplyanyloadontheproduct.(2–4)Donotcutorbendtheleadsofthedeviceswhicharetobestored.Thisistopreventcorrosioninthecutorbentpartoftheleadcausingsolderingproblemsinthecustomer’sassemblingprocess.(2–5)Suddenchangeintemperaturemaycausecondensationintheproductorpacking,therefore,suchlocationsshouldbeavoidedforstoring.Temperatureinstoragelocationsshouldbestable.(2–6)Storageconditionsforcap–lessproductsshallbestatedseparatelybecausetheseproductsrequirestrictercontrolsthanpackagesealedproducts.3.DesignConditionsandEnvironmentunderUse(3–1)Operationinexcessoftheabsolutemaximumratingscancausepermanentdamagetothedevice.Thecustomersarerequestedtodesignnottoexceedthoseratingsevenforashorttime.(3–2)Avoiduseinlocationswherewaterororganicsolventsadheredirectlytotheproduct,orwherethereisanypossibilityofthegenerationofcorrosivegas,explosivegas,dust,salinity,orothertroublesomeconditions.Suchenvironmentswillnotonlysignificantlylowerthereliability,butalsomayleadtoseriousaccidents.(3–3)ContaminationtocapwindoworLDemittingpointbyvolatilematerial,suchasadhesive,maydegradereliability.Whenyouuseadhesivematerial,werecommendyoutoconfirmpossibleeffectbeforeusage.(3–4)Qualityassuranceforcap–lessproductsshallbestatedseparatelybecausetheseproductsrequiremorenoticeinyourlineandyourproductsenvironmentthanpackagesealedproducts.4.StaticElectricSafetyCautionsTheoptoelectronicdevicesaresensitivetostaticelectricity(ESD,electro–staticdischarge).TheproductcanbebrokenbyESD.Whenhandlingthisproduct,pleaseobservethefollowingcountermeasures:<CountermeasuresagainstStaticElectricityandSurge>Topreventbreakofdevicesbystaticelectricityorsurge,pleaseadoptthefollowingcountermeasuresintheassemblyline:(4–1)Groundallequipments,machineryjigs,andtoolsintheprocesslinewithearthwiresinstalledinthem.Takeparticularcarewithhotplates,solderironsandotheritemsforwhichthecommercialpowersuppliesarepronetoleakage.(4–2)Workersshouldalwaysuseearthbands.Useofantistaticclothing,electricconductiveshoes,andothersafetyequipmentwhileatworkishighlyrecommended.(4–3)Useconductivematerialsforthisproduct’scontainer,etc.(4–4)Itisrecommendedthatgroundingmatsbeplacedonthesurfacesofassemblylineworkbenchandthesurroundingfloorinworkarea,etc.(4–5)Whenmountingthisproductinpartsormaterialswhichcanbeelectricallycharged(printedwiringboards,plasticproducts,etc.),paycloseattentiontothestaticelectricityinthoseparts.ESDmaydamagetheproduct.(4–6)Humidityinworkingenvironmentshouldbecontrolledtobe40percentRHorhigher.Thesecountermeasuresaremostgeneral,andthereisaneedtocarefullyconfirmthelineusingthisproduct.Itisextremelyimportanttopreventsurge,eliminateitrapidly,andpreventitfromspreading.
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