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Mitsubishi ML562H84 Datasheet
Microsoft PowerPoint – GNOK-ML562H84-02_draftA.pptx
image/svg+xml
MITSUBISHIELECTRICCORPORATION
CONFIDENTIAL
COMPANYPROPRIETARY
NOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTEN
PERMISSIONOFMITSUBISHIELECTRICCORPORATION
SPECIFICATION
GNOK
–
ML562H84
–
02
–
draftA
(
1
/6)
SPECIFICATION
PREPAREDBY:
M
.
Miyashita
R
E
V
A
M
.
Miyashita
CHECKEDBY:
APPROVEDBY:
T
.
Nishida
T
.
Nishida
DATE:
June
.
5
,
2017
July
.
26
,
2017
1.Type
ML562H84
–
02
2.Application
LightSource
3.Structure
RedLaserDiode
4.Outline
G880390
5.Absolutemaximumratings
No.
PARAMETER
SYMBOL
CONDITION
RATINGS
UNIT
(1)
OperationCurrent
Iop
Pulse(DutyCycle
≦
40%)
Fig.1
(2)
ReverseVoltage
V
RL
–
2
V
(3)
Anode
–
CaseVoltage(*1)
Vac
–
–
200
～
200
V
(4)
OperatingCaseTemperature
Tc
–
0
～
+55
℃
(5)
StorageTemperature
Tstg
–
–
40
～
+85
℃
(6)
SolderingTemperature
Tsol
LeadLength
2mm
320
℃
,2sec
<Note>Themaximumratingmeansthelimitationoverwhichthelasershouldnotbeoperatedeveninstanttime,andthis
doesnotmeantheguaranteeofitslifetime.
Asforthelifetime,refertothereliabilityreportfromMitsubishi
SemiconductorQualityAssuranceSection.
*1:Voltagebetween
Φ
9packageandanodeleadpin
6.Characteristicstable
No.
PARAMETER
SYMBOL
CONDITION
（
Tc=25
℃
(*2)unless
otherwisespecified)
LIMITS
UINT
MIN.
TYP.
MAX.
(1)
OutputPower
Pop
Pulse(*3),
Iop
=2.8A
2.3
2.5
–
W
Pulse(*3),
Iop
=3.6A,Tc=45
℃
2.3
2.5
–
W
Pulse(*3),
Iop
=3.6A,Tc=55
℃
1.6
1.9
–
W
(2)
ThresholdCurrent
Ith
Pulse(*3)
0.60
0.78
0.85
A
(3)
OperatingVoltage
Vop
Pulse(*3),
Iop
=2.8A
–
2.4
2.5
V
(4)
SlopeEfficiency
η
Pulse(*3)
1.00
1.15
1.350
W/A
(5)
PeakWavelength
λ
p
Pulse(*3),
Iop
=2.8A
636
638
642
nm
(6)
BeamDivergence
(FullWidthat1/e2)
θ
//
Pulse(*3),
Iop
=2.8A
–
3.6
4.0
°
θ
⊥
Pulse(*3),
Iop
=2.8A
–
0.5
1.4
°
(7)
BeamTilt
Angle(*4)
Δ
θ
//
Pulse(*3),
Iop
=2.8A
–
1.5
0
1.5
°
Δ
θ
⊥
Pulse(*3),
Iop
=2.8A
–
1.5
0
1.5
°
*2:Actualmeasurementtemperatureisadjusted
inorderto
matchanactivelayertemperaturetothatofstable
conditionatTc=25
℃
.
*
3:
Pulse
condition120Hz,Duty=30%
ThesespecificationsarebasedonMITSUBISHI’smethod.
Draft
A
July.
26
,2017
(Thisdraftspecificationisvalidfor6months)
image/svg+xml
MITSUBISHIELECTRICCORPORATION
CONFIDENTIAL
COMPANYPROPRIETARY
NOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTEN
PERMISSIONOFMITSUBISHIELECTRICCORPORATION
SPECIFICATION
GNOK
–
ML562H84
–
02
–
draftA
(
2
/6)
SPECIFICATION
7.
LDpackingspecification
7
–
1.Thisspecificationisappliedto
ML562H84
–
02
packing
.
7
–
2.Materials
7
–
3.Packingmethod
(1)
LDisinsertedinanelectricallyconductivetray[1],inordertopreventtheelectrically
staticdamage.
Basically,eachLD
–
trayincludes
80pcs
LDs.
However
there
is
the
tray
filled
below
80
pcs
.
(
2
)
The
LD
tray
is
piled
up
.
(Maximum
5
trays)
(
3
)
(
2
)
is
sealed
by
a
wrapping
bag
[
2
]
.
(
4
)
Sealed
LD
trays
(
3
)
are
piled
up
and
put
with
air
cap
[
3
]
in
a
Packing
box
[
4
]
.
The
details
of
each
article
are
shown
in
Fig
.
2
–
Fig
.
4
.
Item
Material
Use
（
Purpose
）
[1]
Tray
Polystyrene
Preventelectricstatic
damage
[2]
Wrapping
bag
Polyethylene
Sealingtraybody
[3]
Air
cap
Polyethylene
Preventvibration
[4]
Packing
box
Corrugatedcardboard
Package
Fig.1
Absolutemaximumratings
ofoperatingcurrent
θ
⊥
（
+
）
θ
⊥
（
–
）
θ
//
（
+
）
θ
//
（
–
）
Top
view
*4:DefinitionofBeamAngle
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
0
10
20
30
40
50
60
A
b
s
o
l
u
t
e
M
a
x
u
m
u
m
C
u
r
r
e
n
t
[
A
]
CaseTemperature[
℃
]
image/svg+xml
MITSUBISHIELECTRICCORPORATION
CONFIDENTIAL
COMPANYPROPRIETARY
NOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTEN
PERMISSIONOFMITSUBISHIELECTRICCORPORATION
SPECIFICATION
GNOK
–
ML562H84
–
02
–
draftA
(
3
/6)
SPECIFICATION
（
T
o
p
s
i
d
e
）
（
B
a
c
k
s
i
d
e
）
F
i
g
.
2
L
D
t
r
a
y
image/svg+xml
MITSUBISHIELECTRICCORPORATION
CONFIDENTIAL
COMPANYPROPRIETARY
NOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTEN
PERMISSIONOFMITSUBISHIELECTRICCORPORATION
SPECIFICATION
GNOK
–
ML562H84
–
02
–
draftA
(
4
/6)
SPECIFICATION
Fig
.
4
Packing
Handling
warning
are
shown
on
the
box
.
Handling
Warning
[
1
]
LD
Tray
(electrically
conductive
polystyrene
)
[
2
]
Wrapping
bag
Fig
.
3
Inside
packing
(Tray
and
Wrapping
bag)
(An
empty
tray
is
put
on
the
top
stage
as
a
lid
.
)
image/svg+xml
MITSUBISHIELECTRICCORPORATION
CONFIDENTIAL
COMPANYPROPRIETARY
NOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTEN
PERMISSIONOFMITSUBISHIELECTRICCORPORATION
SPECIFICATION
GNOK
–
ML562H84
–
02
–
draftA
(
5
/6)
SPECIFICATION
8
.
Safety
precautions
relating
to
handling
of
optical
semiconductor
devices
General
:
Although
manufacturer
is
always
striving
to
improve
the
reliability
of
its
products,
problems
and
errors
may
occur
with
semiconductor
devices
.
Hence,
it
is
necessary
that
user’s
own
products
are
designed
with
full
regard
to
safety
by
incorporating
redundancy,
fire
prevention,
and
error
prevention,
so
any
problems
or
errors
with
semiconductor
device
do
not
cause
accidents,
which
might
result
in
injury,
death,
fire,
or
environmental
hazard
.
The
following
requirements
must
be
strictly
observed
.
Warning!
1
.
Safety
standard
of
laser
devices
Please
follow
closely
to
international
standard
(e
.
g
.
IEC
60825
–
1
)
or
standard
of
each
country
(ex
.
JIS
C
6802
in
Japan)
.
2
.
Laser
characteristics
and
its
danger
When
laser
device
is
operated
at
over
–
driven
condition,
low
temperature,
pulsing
mode,
and
so
on,
it
could
emit
higher
optical
power
than
absolute
maximum
rating,
and
peak
optical
power
might
increase
in
conjunction
with
relaxation
oscillation
.
Laser
device
could
lase
at
different
wavelength
with
different
case
temperature,
or
different
output
power
.
Laser
devices
are
deviated
on
threshold
current,
operating
current,
operating
voltage,
slope
efficiency,
peak
wavelength,
beam
divergence,
and
so
on
.
Not
only
light
output
power,
but
also
polarization
or
far
field
patterns
might
change
as
operating
time
goes
by
.
If
customers
need
more
information
of
laser
device,
please
contact
Mitsubishi
Electric
.
Laser
light
from
each
device
might
seriously
injure
human
eyes
and
skin
.
Customer
should
design
and
manufacture
carefully
their
application
products
based
on
not
only
laser
light
characteristics
but
also
LD
characteristics,
in
order
to
avoid
human
injury
.
Mitsubishi
Electric
is
not
responsible
for
any
accidents
that
are
caused
by
customer’s
products
.
If
customers
plan
to
release
medical
or
aesthetic
products
with
laser
device,
they
should
obtain
their
government’s
laser
safety
authorization
.
3
.
Avoid
laser
light
from
entering
human
eyes
In
normal
operation,
semiconductor
laser
device
emits
laser
light
.
Laser
light
entering
eyes
could
cause
extreme
damage
.
Never
look
against
laser
beam
direction,
and
never
look
directly
through
an
optical
system
such
as
a
lens
.
Use
an
ITV
camera
to
observe
laser
light
.
Mitsubishi
Electric
recommends
that
customers
should
explicitly
label
their
laser
products
with
warning
sign
of
eye
injury
.
4
.
Handling
of
device
Gallium
arsenide
(GaAs)
and
beryllium
oxide
(
BeO
)
are
used
in
laser
device
.
To
avoid
danger,
strictly
observe
the
following
cautions
:
Never
place
the
device
in
human
mouth
.
Never
burn
or
break
the
device
.
Never
use
any
type
of
chemical
treatment
to
reduce
it
to
gas
or
powder
.
When
disposing
device,
always
follow
any
applicable
laws,
as
well
as
customer’s
internal
waste
treatment
regulations
.
5
.
Disposal
of
device
Laser
device
uses
Gallium
arsenide
(GaAs)
and
beryllium
oxide
(
BeO
)
.
It
should
be
disposed
as
a
specially
controlled
industrial
waste,
and
it
should
be
separated
from
general
industrial
and
household
wastes,
according
to
any
“Law
of
Wastes
and
Cleaning”
.
Caution!
1
.
High
temperature
During
operation
device
may
become
hot,
therefore
do
not
directly
touch
it
during
operation
.
The
device
could
remain
hot
even
after
power
is
turned
off,
so
wait
until
it
cools
down
prior
to
touching
to
avoid
any
burn
.
Never
place
any
inflammable
substance
that
may
cause
fire
near
the
device
.
image/svg+xml
MITSUBISHIELECTRICCORPORATION
CONFIDENTIAL
COMPANYPROPRIETARY
NOTTOBEDISCLOSEDWITHOUTSPECIFICWRITTEN
PERMISSIONOFMITSUBISHIELECTRICCORPORATION
SPECIFICATION
GNOK
–
ML562H84
–
02
–
draftA
(
6
/6)
SPECIFICATION
9
.
Handling
Cautions
for
Optoelectronic
Devices
1.General
(1
–
1)Theproductsdescribedinthisspecificationaredesignedandmanufacturedforuseingeneral
communicationsystemsorelectronicdevices,unlesstheirapplicationsorreliabilityareotherwisespecified.
Therefore,theyarenotdesignedormanufacturedforinstallationindevicesorsystemsthatmayaffecthumanlife
orthatareusedinsocialinfrastructurerequiringhighreliability.
(1
–
2)Whenthecustomerisconsideringtousetheproductsdescribedinthisspecificationinspecialapplications,
suchastransportationsystems(automobiles,trains,vessels),medicalequipments,aerospace,nuclearpower
control,andsubmarinerepeatersorsystems,pleasecontactMitsubishiElectricoranauthorizeddistributor.
2.StorageConditions
Whenstoringtheproducts,itisrecommendedtostorethemfollowingtheconditionsdescribedbelowwithout
openingthepacking.Nottakingenoughcareinstoringmayresultindefectsinelectricalcharacteristics,soldering
quality,visualappearance,andsoon.Themainpointsaredescribedbelow(ifspecialstorageconditionsare
giventotheproductinthespecificationsheet,theyhavepriorityoverthefollowinggeneralcautions):
(2
–
1)Appropriatetemperatureandhumidityconditions,i.e.,temperaturerangebetween5
～
35
℃
,andhumidity
between45
～
75percentRH,shouldbemaintainedinstoragelocations.Controllingthetemperatureandhumidity
withinthisrangeisparticularlyimportantincaseoflong
–
termstorageforsixmonthsormore.
(2
–
2)Theatmosphereshouldbeparticularlyfreefromtoxicgasesanddust.
(2
–
3)Donotapplyanyloadontheproduct.
(2
–
4)Donotcutorbendtheleadsofthedeviceswhicharetobestored.Thisistopreventcorrosioninthecutor
bentpartoftheleadcausingsolderingproblemsinthecustomer’sassemblingprocess.
(2
–
5)Suddenchangeintemperaturemaycausecondensationintheproductorpacking,therefore,suchlocations
shouldbeavoidedforstoring.Temperatureinstoragelocationsshouldbestable.
(2
–
6)Storageconditionsforcap
–
lessproductsshallbestatedseparatelybecausetheseproductsrequirestricter
controlsthanpackagesealedproducts.
3.DesignConditionsandEnvironmentunderUse
(3
–
1)Operationinexcessoftheabsolutemaximumratingscancausepermanentdamagetothedevice.The
customersarerequestedtodesignnottoexceedthoseratingsevenforashorttime.
(3
–
2)Avoiduseinlocationswherewaterororganicsolventsadheredirectlytotheproduct,orwherethereisany
possibilityofthegenerationofcorrosivegas,explosivegas,dust,salinity,orothertroublesomeconditions.Such
environmentswillnotonlysignificantlylowerthereliability,butalsomayleadtoseriousaccidents.
(3
–
3)ContaminationtocapwindoworLDemittingpointbyvolatilematerial,suchasadhesive,maydegrade
reliability.Whenyouuseadhesivematerial,werecommendyoutoconfirmpossibleeffectbeforeusage.
(3
–
4)Qualityassuranceforcap
–
lessproductsshallbestatedseparatelybecausetheseproductsrequiremore
noticeinyourlineandyourproductsenvironmentthanpackagesealedproducts.
4.StaticElectricSafetyCautions
Theoptoelectronicdevicesaresensitivetostaticelectricity(ESD,electro
–
staticdischarge).Theproductcanbe
brokenbyESD.Whenhandlingthisproduct,pleaseobservethefollowingcountermeasures:
<CountermeasuresagainstStaticElectricityandSurge>
Topreventbreakofdevicesbystaticelectricityorsurge,pleaseadoptthefollowingcountermeasuresinthe
assemblyline:
(4
–
1)Groundallequipments,machineryjigs,andtoolsintheprocesslinewithearthwiresinstalledinthem.Take
particularcarewithhotplates,solderironsandotheritemsforwhichthecommercialpowersuppliesareproneto
leakage.
(4
–
2)Workersshouldalwaysuseearthbands.Useofantistaticclothing,electricconductiveshoes,andother
safetyequipmentwhileatworkishighlyrecommended.
(4
–
3)Useconductivematerialsforthisproduct’scontainer,etc.
(4
–
4)Itisrecommendedthatgroundingmatsbeplacedonthesurfacesofassemblylineworkbenchandthe
surroundingfloorinworkarea,etc.
(4
–
5)Whenmountingthisproductinpartsormaterialswhichcanbeelectricallycharged(printedwiringboards,
plasticproducts,etc.),paycloseattentiontothestaticelectricityinthoseparts.ESDmaydamagetheproduct.
(4
–
6)Humidityinworkingenvironmentshouldbecontrolledtobe40percentRHorhigher.
Thesecountermeasuresaremostgeneral,andthereisaneedtocarefullyconfirmthelineusingthisproduct.Itis
extremelyimportanttopreventsurge,eliminateitrapidly,andpreventitfromspreading.
image/svg+xml
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