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Mitsubishi ML501P73 Datasheet

ML501P73
image/svg+xml1<Laser Diodes for Display>ML501P73Lateralmulti-modeφ5.6mm capless PKGPublication Date : Jan. 14th, 2020DESCRIPTIONMitsubishi ML501P73 is a high-power, highly efficient semiconductor laser diode which provides emission wavelength of 638 nm and standard light output of 1.0W (pulse) and 0.5W (CW).This LD has broad-stripe structure which enables high output power.Note1: The maximum rating means the limitation over which the laser should not be operated even instant time. This does not mean the guarantee of its lifetime. As for the reliability, please refer to the reliability report issued by Quality Assurance Section, HF & Optical Semiconductor Division, Mitsubishi Electric Corporation.ELECTRICAL/OPTICAL CHARACTERISTICS(Tc=25°C)SymbolParameterTest conditionsMin.Typ.MaxUnitIthThreshold currentCW90170210mAIopOperating currentCW, Po=0.5W500650800mAVopOperating voltageCW, Po=0.5W1.92.22.6VηSlope efficiencyCW, Po=0.5W0.81.01.4mW/mAλpPeak wavelengthCW, Po=0.5W632638644nmθ//Beam divergence angle (parallel)CW, Po=0.5W17.515°θ⊥Beam divergence angle (perpendicular)CW, Po=0.5W253545°ABSOLUTE MAXIMUM RATINGS(Note 1)SymbolParameterConditionsRatingsUnitPoLight output powerCW0.5WPulse Duty≤33%, frequency≥50Hz1.0WVRLReverse voltage-2VTcCase temperature--5 ~ +40°CTstgStorage temperature--40 ~ +100°CFEATURES• High Output Power: 1.0W(Pulse)0.5W (CW)• High Efficiency: 1.0mW/mA (typ.)• Visible Light: 638nm (typ.)• φ5.6mm capless PKGAPPLICATION• Display system, Bio-medical
image/svg+xml<Laser Diodes for Display>Lateral multi-modeφ5.6mm cap less PKGML501P73Publication Date : Jan. 14th, 20202Typical Characteristics of ML501P73OUTLINE DRAWINGSML501P73ML501P73LD(2)(1)(3)CASEφ5.6mm CaplessDimensions in mm1.0±0.1φ5.6-0.0300.4±0.11.5±0.10.5(typical)Xφ2.0±0.3(P.C.D)3.8(typical)1.77(typical)2.3MAX1.2±0.16.5±1.00.4MAXφ1.2MAX3-φ0.45±0.10.4-0Y+0.1(2) (3) (1)Light Output Power vs. Current (Pulse)0.00.20.40.60.81.00500100015002000Current [mA]Light Output Power [W]Pulsef=50Hz,D=33%Tc=15 25 35 40℃Light Output Power vs. Current (CW)00.10.20.30.40.502004006008001000Current [mA]Light Output Power [W]CWTc=15 25 35 40℃
image/svg+xml<Laser Diodes for Display>Lateral multi-modeφ5.6mm cap less PKGML501P73Publication Date : Jan. 14th, 20203Typical Characteristics of ML562G84Far-Field-Patterns-50-40-30-20-1001020304050Angle(°)Intensity(a.u.)Po=0.5W, CWTc=25℃θ⊥=35°(FWHM)θ∥=7.5°(FWHM)Peak Wavelength vs. Light Output Power6206256306356406456506550100200300400500600Light output Power(mW)Peak Wavelength(nm)Tc=25℃CW～5nm/WPeak Wavelength vs. Temperature6206256306356406456506550102030405060Temperature(℃)Peak Wavelength(nm)Po=0.5WCW～0.20nm/℃
image/svg+xml<Laser Diodes for Display>Lateral multi-modeφ5.6mm cap less PKGML501P73Publication Date : Jan. 14th, 20204Safety precaution for handling optical semiconductor devicesGeneral:Although manufacturer is always striving to improve the reliability of its products, problems and errors may occur with semiconductor devices. Hence, it is necessary that user’s own products are designed with full regard to safety by incorporating redundancy, fire prevention, and error prevention, so any problems or errors with semiconductor device do not cause accidents, which might result in injury, death, fire, or environmental hazard. The following requirements must be strictly observed.Warning!1. Safety standard of laser devicesPlease follow closely to international standard (e.g. IEC 60825-1) or standard of each country (ex. JIS C 6802 in Japan).2. Laser characteristics and its dangerWhen laser device is operated at over-driven condition, low temperature, pulsing mode, and so on, it could emit higher optical power than absolute maximum rating, and peak optical power might increase in conjunction with relaxation oscillation. Laser device could lase at different wavelength with different case temperature, or different output power. Laser devices are deviated on threshold current, operating current, operating voltage, slope efficiency, peak wavelength, beam divergence, and so on. Not only light output power, but also polarization or far field patterns might change as operating time goes by. If customers need more information of laser device, please contact Mitsubishi Electric.Laser light from each device might seriously injure human eyes and skin. Customer should design and manufacture carefully their application products based on not only laser light characteristics but also LD characteristics, in order to avoid human injury. Mitsubishi Electric is not responsible for any accidents that are caused by customer’s products.If customers plan to release medical or aesthetic products with laser device, they should obtain their government’s laser safety authorization.3. Avoid laser light from entering human eyes In normal operation, semiconductor laser device emits laser light. Laser light entering eyes could cause extreme damage. Never look against laser beam direction, and never look directly through an optical system such as a lens. Use an ITV camera to observe laser light. Mitsubishi Electric recommends that customers should explicitly label their laser products with warning sign of eye injury.4. Handling of deviceGallium arsenide (GaAs) is used in laser device. To avoid danger, strictly observe the following cautions:Never place the device in human mouth. Never burn or break the device. Never use any type of chemical treatment to reduce it to gas or powder. When disposing device, always follow any applicable laws, as well as customer’s internal waste treatment regulations.5. Disposal of deviceLaser device uses Gallium arsenide (GaAs). It should be disposed as a specially controlled industrial waste, and it should be separated from general industrial and household wastes, according to any “Law of Wastes and Cleaning”. Caution!1. High temperature During operation device may become hot, therefore do not directly touch it during operation. The device could remain hot even after power is turned off, so wait until it cools down prior to touching to avoid any burn. Never place any inflammable substance that may cause fire near the device.
image/svg+xml<Laser Diodes for Display>Lateral multi-modeφ5.6mm cap less PKGML501P73Publication Date : Jan. 14th, 20205Handling Cautions for Optoelectronic Devices1.General(1-1)Theproductsdescribedinthisspecificationaredesignedandmanufacturedforuseingeneralcommunicationsystemsorelectronicdevices,unlesstheirapplicationsorreliabilityareotherwisespecified.Therefore,theyarenotdesignedormanufacturedforinstallationindevicesorsystemsthatmayaffecthumanlifeorthatareusedinsocialinfrastructurerequiringhighreliability.(1-2)Whenthecustomerisconsideringtousetheproductsdescribedinthisspecificationinspecialapplications,suchastransportationsystems(automobiles,trains,vessels),medicalequipments,aerospace,nuclearpowercontrol,andsubmarinerepeatersorsystems,pleasecontactMitsubishiElectricoranauthorizeddistributor.2.StorageConditionsWhenstoringtheproducts,itisrecommendedtostorethemfollowingtheconditionsdescribedbelowwithoutopeningthepacking.Nottakingenoughcareinstoringmayresultindefectsinelectricalcharacteristics,solderingquality,visualappearance,andsoon.Themainpointsaredescribedbelow(ifspecialstorageconditionsaregiventotheproductinthespecificationsheet,theyhavepriorityoverthefollowinggeneralcautions):(2-1)Appropriatetemperatureandhumidityconditions,i.e.,temperaturerangebetween5～35°C,andhumiditybetween45～75percentRH,shouldbemaintainedinstoragelocations.Controllingthetemperatureandhumiditywithinthisrangeisparticularlyimportantincaseoflong-termstorageforsixmonthsormore.(2-2)Theatmosphereshouldbeparticularlyfreefromtoxicgasesanddust.(2-3)Donotapplyanyloadontheproduct.(2-4)Donotcutorbendtheleadsofthedeviceswhicharetobestored.Thisistopreventcorrosioninthecutorbentpartoftheleadcausingsolderingproblemsinthecustomer’sassemblingprocess.(2-5)Suddenchangeintemperaturemaycausecondensationintheproductorpacking,therefore,suchlocationsshouldbeavoidedforstoring.Temperatureinstoragelocationsshouldbestable.(2-6)Storageconditionsforcap-lessproductsshallbestatedseparatelybecausetheseproductsrequirestrictercontrolsthanpackagesealedproducts.3.DesignConditionsandEnvironmentunderUse(3-1)Operationinexcessoftheabsolutemaximumratingscancausepermanentdamagetothedevice.Thecustomersarerequestedtodesignnottoexceedthoseratingsevenforashorttime.(3-2)Avoiduseinlocationswherewaterororganicsolventsadheredirectlytotheproduct,orwherethereisanypossibilityofthegenerationofcorrosivegas,explosivegas,dust,salinity,orothertroublesomeconditions.Suchenvironmentswillnotonlysignificantlylowerthereliability,butalsomayleadtoseriousaccidents.(3-3)ContaminationtocapwindoworLDemittingpointbyvolatilematerial,suchasadhesive,maydegradereliability.Whenacustomeruseadhesivematerial,werecommendthecustomertoconfirmpossibleeffectbeforeusage.(3-4)Qualityassuranceforcap-lessproductsshallbestatedseparatelybecausetheseproductsrequiremorenoticeinyourlineandyourproductsenvironmentthanpackagesealedproducts.4.StaticElectricSafetyCautionsTheoptoelectronicdevicesaresensitivetostaticelectricity(ESD,electro-staticdischarge).TheproductcanbebrokenbyESD.Whenhandlingthisproduct,pleaseobservethefollowingcountermeasures:<CountermeasuresagainstStaticElectricityandSurge>Topreventbreakofdevicesbystaticelectricityorsurge,pleaseadoptthefollowingcountermeasuresintheassemblyline:(4-1)Groundallequipments,machineryjigs,andtoolsintheprocesslinewithearthwiresinstalledinthem.Takeparticularcarewithhotplates,solderironsandotheritemsforwhichthecommercialpowersuppliesarepronetoleakage.(4-2)Workersshouldalwaysuseearthbands.Useofantistaticclothing,electricconductiveshoes,andothersafetyequipmentwhileatworkishighlyrecommended.(4-3)Useconductivematerialsforthisproduct’scontainer,etc.(4-4)Itisrecommendedthatgroundingmatsbeplacedonthesurfacesofassemblylineworkbenchandthesurroundingfloorinworkarea,etc.(4-5)Whenmountingthisproductinpartsormaterialswhichcanbeelectricallycharged(printedwiringboards,plasticproducts,etc.),paycloseattentiontothestaticelectricityinthoseparts.ESDmaydamagetheproduct.(4-6)Humidityinworkingenvironmentshouldbecontrolledtobe40percentRHorhigher.Thesecountermeasuresaremostgeneral,andthereisaneedtocarefullyconfirmthelineusingthisproduct.Itisextremelyimportanttopreventsurge,eliminateitrapidly,andpreventitfromspreading.
image/svg+xml<Laser Diodes for Display>Lateral multi-modeφ5.6mm cap less PKGML501P73Publication Date : Jan. 14th, 20206© MITSUBISHI ELECTRIC CORPORATIONKeep safety first in your circuit designs!MitsubishiElectricCorporationputsthemaximumeffortintomakingsemiconductorproductsbetterandmorereliable,butthereisalwaysthepossibilitythattroublemayoccurwiththem.Troublewithsemiconductorsmayleadtopersonalinjury,fireorpropertydamage.Remembertogivedueconsiderationtosafetywhenmakingyourcircuitdesigns,withappropriatemeasuressuchas(i)placementofsubstitutive,auxiliarycircuits,(ii)useofnon-flammablematerialor(iii)preventionagainstanymalfunctionormishap.Notes regarding these materials•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.•All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein.The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).•When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.•If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination.Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
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