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Mitsubishi ML562G84 Datasheet

ML562G84
image/svg+xml1<Laser Diodes for Display>ML562G84Lateralmulti-mode / Multi emitterφ9mm TO-CAN PKGPublication Date : Jan. 14th, 2020DESCRIPTIONMitsubishi ML562G84 is a high-power, highly efficient semiconductor laser diode which provides emission wavelength of 638 nm and standard light output of 2.5W(pulse).This LD has broad-stripe structure which enables high output power.Note1: The maximum rating means the limitation over which the laser should not be operated even instant time. This does not mean the guarantee of its lifetime. As for the reliability, please refer to the reliability report issued by Quality Assurance Section, HF & Optical Semiconductor Division, Mitsubishi Electric Corporation.ELECTRICAL/OPTICAL CHARACTERISTICS(Tc=25°C)SymbolParameterTest conditionsMin.Typ.MaxUnitPopOutput powerPulse(*), Iop=2.8A2.32.5-WIthThreshold currentPulse(*), Iop=2.8A0.640.780.86AVopOperating voltagePulse(*), Iop=2.8A2.12.42.5VηSlope efficiencyPulse(*), Iop=2.8A1.11.251.5W/AλpPeak wavelengthPulse(*), Iop=2.8A636638642nmθ//Beam divergence angle (Full Width at 1/e2)Pulse(*), Iop=2.8A6810°θ⊥Pulse(*), Iop=2.8A607080°ABSOLUTE MAXIMUM RATINGS(Note 1)SymbolParameterConditionsRatingsUnitIopOperating currentPulse(Duty ≦40%)Fig.1AVRLReverse voltage-2VTcCase temperature-0 ~ +55°CTstgStorage temperature--40 ~ +85°CFig.1Absolute maximum ratingsof operating current *:Pulse condition 120Hz,Duty=30%FEATURES• High Output Power ( Pulse condition 120Hz,Duty=30%): 2.5W(0 ≦Tc ≦45℃)2.2W (Tc =50℃)1.9W (Tc =55℃)• High Efficiency: 1.25W/A (typ.)• Visible Light: 638nm (typ.)• φ9mm TO-CAN PKGAPPLICATION• Display system
image/svg+xml<Laser Diodes for Display>Lateral multi-mode / Multi emitterφ9mm TO-CAN PKGML562G84Publication Date : Jan. 14th, 20202Typical Characteristics of ML562G840.00.51.01.52.02.50123Light Output Power [W]Current [A]Tc=0 15 25 354555 ℃Pulsef=120Hz,D=30%Light Output Power vs. Current (Pulse)OUTLINE DRAWINGSML562G84ML562G84LD(2)(1)φ9mmDimensions in mmXY0.490°φ2.54(P. C. D. )0.651.0±0.11.0±0.05φ3.5±0.1φ6.6±0.1φ7.3±0.2φ9.0+0/-0.03φ2-0.60±0.056.5±0.51.5±0.052.85±0.30.25±0.03(Glass)(1)(2)Reference plane(2.0)
image/svg+xml<Laser Diodes for Display>Lateral multi-mode / Multi emitterφ9mm TO-CAN PKGML562G84Publication Date : Jan. 14th, 20203Typical Characteristics of ML562G84620 625 630 635 640 645 650 655 0123Peak Wavelength [nm]Light output Power [W]Tc=25℃～0.73nm/WPulse 120Hz,D=30%Peak Wavelength vs. Light Output Power620 625 630 635 640 645 650 655 0102030405060Peak Wavelength [nm]Tc [℃]～0.20nm/℃Po=2.5WPo=1.9WPulse 120Hz,D=30%Peak Wavelength vs. Temperature-50-40-30-20-1001020304050Intensity [a.u.]Angle [deg.]θ⊥(1/e2)：67.0°θ∥(1/e2)：7.8°Po=2.5WTc=25℃Pulse 120Hz,D=30%Far-Field-Patterns
image/svg+xml<Laser Diodes for Display>Lateral multi-mode / Multi emitterφ9mm TO-CAN PKGML562G84Publication Date : Jan. 14th, 20204Safety precaution for handling optical semiconductor devicesGeneral:Althoughmanufacturerisalwaysstrivingtoimprovethereliabilityofitsproducts,problemsanderrorsmayoccurwithsemiconductordevices.Hence,itisnecessarythatuser’sownproductsaredesignedwithfullregardtosafetybyincorporatingredundancy,fireprevention,anderrorprevention,soanyproblemsorerrorswithsemiconductordevicedonotcauseaccidents,whichmightresultininjury,death,fire,orenvironmentalhazard.Thefollowingrequirementsmustbestrictlyobserved.Warning!1. Safety standard of laser devicesPleasefollowcloselytointernationalstandard(e.g.IEC60825-1)orstandardofeachcountry(ex.JISC6802inJapan).2. Laser characteristics and its dangerWhenlaserdeviceisoperatedatover-drivencondition,lowtemperature,pulsingmode,andsoon,itcouldemithigheropticalpowerthanabsolutemaximumrating,andpeakopticalpowermightincreaseinconjunctionwithrelaxationoscillation.Laserdevicecouldlaseatdifferentwavelengthwithdifferentcasetemperature,ordifferentoutputpower.Laserdevicesaredeviatedonthresholdcurrent,operatingcurrent,operatingvoltage,slopeefficiency,peakwavelength,beamdivergence,andsoon.Notonlylightoutputpower,butalsopolarizationorfarfieldpatternsmightchangeasoperatingtimegoesby.Ifcustomersneedmoreinformationoflaserdevice,pleasecontactMitsubishiElectric.Laserlightfromeachdevicemightseriouslyinjurehumaneyesandskin.CustomershoulddesignandmanufacturecarefullytheirapplicationproductsbasedonnotonlylaserlightcharacteristicsbutalsoLDcharacteristics,inordertoavoidhumaninjury.MitsubishiElectricisnotresponsibleforanyaccidentsthatarecausedbycustomer’sproducts.Ifcustomersplantoreleasemedicaloraestheticproductswithlaserdevice,theyshouldobtaintheirgovernment’slasersafetyauthorization.3. Avoid laser light from entering human eyesInnormaloperation,semiconductorlaserdeviceemitslaserlight.Laserlightenteringeyescouldcauseextremedamage.Neverlookagainstlaserbeamdirection,andneverlookdirectlythroughanopticalsystemsuchasalens.UseanITVcameratoobservelaserlight.MitsubishiElectricrecommendsthatcustomersshouldexplicitlylabeltheirlaserproductswithwarningsignofeyeinjury.4. Handling of deviceGalliumarsenide(GaAs)andberylliumoxide(BeO)isusedinlaserdevice.Toavoiddanger,strictlyobservethefollowingcautions:Neverplacethedeviceinhumanmouth.Neverburnorbreakthedevice.Neveruseanytypeofchemicaltreatmenttoreduceittogasorpowder.Whendisposingdevice,alwaysfollowanyapplicablelaws,aswellascustomer’sinternalwastetreatmentregulations.5. Disposal of deviceLaserdeviceusesGalliumarsenide(GaAs)andberylliumoxide(BeO)..Itshouldbedisposedasaspeciallycontrolledindustrialwaste,anditshouldbeseparatedfromgeneralindustrialandhouseholdwastes,accordingtoany“LawofWastesandCleaning”.Caution!1. High temperature Duringoperationdevicemaybecomehot,thereforedonotdirectlytouchitduringoperation.Thedevicecouldremainhotevenafterpoweristurnedoff,sowaituntilitcoolsdownpriortotouchingtoavoidanyburn.Neverplaceanyinflammablesubstancethatmaycausefirenearthedevice.
image/svg+xml<Laser Diodes for Display>Lateral multi-mode / Multi emitterφ9mm TO-CAN PKGML562G84Publication Date : Jan. 14th, 20205Handling Cautions for Optoelectronic Devices1.General(1-1)Theproductsdescribedinthisspecificationaredesignedandmanufacturedforuseingeneralcommunicationsystemsorelectronicdevices,unlesstheirapplicationsorreliabilityareotherwisespecified.Therefore,theyarenotdesignedormanufacturedforinstallationindevicesorsystemsthatmayaffecthumanlifeorthatareusedinsocialinfrastructurerequiringhighreliability.(1-2)Whenthecustomerisconsideringtousetheproductsdescribedinthisspecificationinspecialapplications,suchastransportationsystems(automobiles,trains,vessels),medicalequipments,aerospace,nuclearpowercontrol,andsubmarinerepeatersorsystems,pleasecontactMitsubishiElectricoranauthorizeddistributor.2.StorageConditionsWhenstoringtheproducts,itisrecommendedtostorethemfollowingtheconditionsdescribedbelowwithoutopeningthepacking.Nottakingenoughcareinstoringmayresultindefectsinelectricalcharacteristics,solderingquality,visualappearance,andsoon.Themainpointsaredescribedbelow(ifspecialstorageconditionsaregiventotheproductinthespecificationsheet,theyhavepriorityoverthefollowinggeneralcautions):(2-1)Appropriatetemperatureandhumidityconditions,i.e.,temperaturerangebetween5～35°C,andhumiditybetween45～75percentRH,shouldbemaintainedinstoragelocations.Controllingthetemperatureandhumiditywithinthisrangeisparticularlyimportantincaseoflong-termstorageforsixmonthsormore.(2-2)Theatmosphereshouldbeparticularlyfreefromtoxicgasesanddust.(2-3)Donotapplyanyloadontheproduct.(2-4)Donotcutorbendtheleadsofthedeviceswhicharetobestored.Thisistopreventcorrosioninthecutorbentpartoftheleadcausingsolderingproblemsinthecustomer’sassemblingprocess.(2-5)Suddenchangeintemperaturemaycausecondensationintheproductorpacking,therefore,suchlocationsshouldbeavoidedforstoring.Temperatureinstoragelocationsshouldbestable.(2-6)Storageconditionsforcap-lessproductsshallbestatedseparatelybecausetheseproductsrequirestrictercontrolsthanpackagesealedproducts.3.DesignConditionsandEnvironmentunderUse(3-1)Operationinexcessoftheabsolutemaximumratingscancausepermanentdamagetothedevice.Thecustomersarerequestedtodesignnottoexceedthoseratingsevenforashorttime.(3-2)Avoiduseinlocationswherewaterororganicsolventsadheredirectlytotheproduct,orwherethereisanypossibilityofthegenerationofcorrosivegas,explosivegas,dust,salinity,orothertroublesomeconditions.Suchenvironmentswillnotonlysignificantlylowerthereliability,butalsomayleadtoseriousaccidents.(3-3)ContaminationtocapwindoworLDemittingpointbyvolatilematerial,suchasadhesive,maydegradereliability.Whenacustomeruseadhesivematerial,werecommendthecustomertoconfirmpossibleeffectbeforeusage.(3-4)Qualityassuranceforcap-lessproductsshallbestatedseparatelybecausetheseproductsrequiremorenoticeinyourlineandyourproductsenvironmentthanpackagesealedproducts.4.StaticElectricSafetyCautionsTheoptoelectronicdevicesaresensitivetostaticelectricity(ESD,electro-staticdischarge).TheproductcanbebrokenbyESD.Whenhandlingthisproduct,pleaseobservethefollowingcountermeasures:<CountermeasuresagainstStaticElectricityandSurge>Topreventbreakofdevicesbystaticelectricityorsurge,pleaseadoptthefollowingcountermeasuresintheassemblyline:(4-1)Groundallequipments,machineryjigs,andtoolsintheprocesslinewithearthwiresinstalledinthem.Takeparticularcarewithhotplates,solderironsandotheritemsforwhichthecommercialpowersuppliesarepronetoleakage.(4-2)Workersshouldalwaysuseearthbands.Useofantistaticclothing,electricconductiveshoes,andothersafetyequipmentwhileatworkishighlyrecommended.(4-3)Useconductivematerialsforthisproduct’scontainer,etc.(4-4)Itisrecommendedthatgroundingmatsbeplacedonthesurfacesofassemblylineworkbenchandthesurroundingfloorinworkarea,etc.(4-5)Whenmountingthisproductinpartsormaterialswhichcanbeelectricallycharged(printedwiringboards,plasticproducts,etc.),paycloseattentiontothestaticelectricityinthoseparts.ESDmaydamagetheproduct.(4-6)Humidityinworkingenvironmentshouldbecontrolledtobe40percentRHorhigher.Thesecountermeasuresaremostgeneral,andthereisaneedtocarefullyconfirmthelineusingthisproduct.Itisextremelyimportanttopreventsurge,eliminateitrapidly,andpreventitfromspreading.
image/svg+xml<Laser Diodes for Display>Lateral multi-mode / Multi emitterφ9mm TO-CAN PKGML562G84Publication Date : Jan. 14th, 20206© Mitsubishi Electric CorporationKeep safety first in your circuit designs!MitsubishiElectricCorporationputsthemaximumeffortintomakingsemiconductorproductsbetterandmorereliable,butthereisalwaysthepossibilitythattroublemayoccurwiththem.Troublewithsemiconductorsmayleadtopersonalinjury,fireorpropertydamage.Remembertogivedueconsiderationtosafetywhenmakingyourcircuitdesigns,withappropriatemeasuressuchas(i)placementofsubstitutive,auxiliarycircuits,(ii)useofnon-flammablematerialor(iii)preventionagainstanymalfunctionormishap.Notes regarding these materials•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.•All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein.The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).•When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.•If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination.Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
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